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JX Nippon Mining & Metals Co., Ltd.

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  2012 Application Ranking      176th  publications: 256 上昇2011: 215th  199)

  2012 Acquisition Ranking      224th  registrations: 173 下降2011: 185th  194)

(update:Jun 2, 2023)

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公報番号発明の名称公報発行日備考
特開 2012-255180 Liquid crystal polymer copper clad laminate and copper foil used for the laminate Dec 27, 2012
再表 2011-10529 Cu-Ga alloy sintered body sputtering target, method for manufacturing the target, light absorption layer made from Cu-Ga alloy sintered body target, and CIGS solar cell using the light absorption layer Dec 27, 2012
再表 2011-4664 Copper foil composite Dec 20, 2012
特開 2012-251238 Method for recovering tin from arsenic-containing solution Dec 20, 2012
特開 2012-251209 Copper foil for producing graphene and method for producing graphene Dec 20, 2012
特開 2012-246556 Rolled copper foil, copper clad laminates, flexible printed wiring boards and electronic devices Dec 13, 2012
再表 2011-1847 Electrolytic copper plating solution for embedding ULSI fine copper wiring Dec 13, 2012
再表 2011-1974 Cu-Ga target and manufacturing method thereof Dec 13, 2012
特開 2012-241232 Rolled copper alloy foil and current collector for secondary battery using the same Dec 10, 2012
特開 2012-241262 Spot plating device and backup member for spot plating device Dec 10, 2012
再表 2011-1552 Copper foil for printed wiring boards Dec 10, 2012
特開 2012-243572 Positive electrode active material for lithium ion battery and method for producing the same Dec 10, 2012
再表 2011-1551 Copper foil for printed wiring boards Dec 10, 2012
特開 2012-243454 Rolled copper foil, negative electrode current collector using the same, negative electrode plate, and secondary battery Dec 10, 2012
特開 2012-237067 Method for manufacturing ruthenium alloy sintered body target Dec 6, 2012

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2012-255180 2011-10529 2011-4664 2012-251238 2012-251209 2012-246556 2011-1847 2011-1974 2012-241232 2012-241262 2011-1552 2012-243572 2011-1551 2012-243454 2012-237067

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