Patent Ranking in Japan - Applicant details - Japanese version

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JX Nippon Mining & Metals Co., Ltd.

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  2013 Application Ranking      158th  publications: 313 上昇2012: 176th  256)

  2013 Acquisition Ranking      176th  registrations: 235 上昇2012: 224th  173)

(update:Jan 11, 2022)

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公報番号発明の名称公報発行日備考
特許 5378415 Metal foil with carrier Dec 25, 2013
特許 5377831 Method for forming seed layer for damascene copper wiring, and semiconductor wafer having damascene copper wiring formed using this method Dec 25, 2013
特許 5379010 A ytterbium sputtering target and a method for manufacturing the same. Dec 25, 2013
特許 5378286 Titanium copper and method of manufacturing the same Dec 25, 2013
特許 5373453 Copper foil for printed wiring boards Dec 18, 2013
特許 5373889 Positive electrode active material for lithium-ion batteries Dec 18, 2013
特許 5368581 Titanium copper for electronic parts Dec 18, 2013
特許 5368627 Positive electrode active material for lithium ion battery, positive electrode for lithium ion battery, and lithium ion battery Dec 18, 2013
特許 5371783 ULSI fine wiring member having ruthenium electroplating layer on barrier layer Dec 18, 2013
特許 5373598 Printed circuit board terminals Dec 18, 2013
特許 5373995 Copper foil with carrier Dec 18, 2013
特許 5373993 Copper foil with carrier Dec 18, 2013
特許 5362921 Surface-treated copper foil and laminated board using it Dec 11, 2013
特許 5362899 Surface-treated copper foil and laminate using the same Dec 11, 2013
特許 5362922 Surface-treated copper foil and laminate using the same Dec 11, 2013

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5378415 5377831 5379010 5378286 5373453 5373889 5368581 5368627 5371783 5373598 5373995 5373993 5362921 5362899 5362922

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Patent Ranking in Japan

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