Patent Ranking in Japan - Applicant details - Japanese version

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JX Nippon Mining & Metals Co., Ltd.

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  2015 Application Ranking      156th  publications: 297 下降2014: 152th  300)

  2015 Acquisition Ranking      184th  registrations: 166 下降2014: 168th  260)

(update:Dec 2, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
B 5837183 Sintered body for forming low refractive index film and method for producing the same Dec 24, 2015
B 5837202 High-purity copper-cobalt alloy sputtering target Dec 24, 2015
B 5837214 Niobium sputtering target Dec 24, 2015
B 5832665 Leaching method of gold from gold ore containing pyrite Dec 16, 2015
B 5829739 Co-Cr-Pt-B alloy sputtering target and method for manufacturing the same Dec 9, 2015
B 5829747 Magnetic material sputtering target and manufacturing method thereof Dec 9, 2015
B 5829757 Tantalum sputtering target and manufacturing method thereof Dec 9, 2015
B 5826160 Rolled copper foil, copper clad laminate, flexible printed wiring board and method for producing the same Dec 2, 2015
B 5826303 Copper foil for printed circuits and copper-clad laminates Dec 2, 2015
B 5826322 Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, circuit forming substrate for semiconductor package, semiconductor package and method for manufacturing printed wiring board Dec 2, 2015
B 5826915 Polycrystalline silicon wafer Dec 2, 2015
B 5826945 Sputtering target for magnetic recording media Dec 2, 2015
B 5822895 Copper alloy plate and heat dissipation electronic component including the same Nov 25, 2015
B 5822928 Electrolytic copper foil having high strength and less warpage and method for producing the same Nov 25, 2015
B 5823005 Carrier copper foil manufacturing method, copper clad laminate manufacturing method, printed wiring board manufacturing method, electronic device and carrier copper foil Nov 25, 2015

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5837183 5837202 5837214 5832665 5829739 5829747 5829757 5826160 5826303 5826322 5826915 5826945 5822895 5822928 5823005

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Patent Ranking in Japan

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