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JX Nippon Mining & Metals Co., Ltd.

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  2015 Application Ranking      156th  publications: 297 下降2014: 152th  300)

  2015 Acquisition Ranking      184th  registrations: 166 下降2014: 168th  260)

(update:Nov 29, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
2013-161334 Copper foil with carrier, manufacturing method of copper foil with carrier and printed wiring board Dec 24, 2015
A 2015-232167 Separation method and analysis method of trace precious metals Dec 24, 2015
A 2015-232170 Silver smelting method Dec 24, 2015
A 2015-229791 Metallic materials for electronic components, connector terminals using them, connectors and electronic components Dec 21, 2015
A 2015-230944 Rare earth thin film magnets, their manufacturing methods, and targets for forming rare earth thin film magnets Dec 21, 2015
A 2015-227060 Manufacturing method of copper foil with carrier, printed wiring board, copper-clad laminate, electronic device, copper foil with carrier, and manufacturing method of printed wiring board Dec 17, 2015
A 2015-227502 Manufacturing method of copper foil with carrier, printed wiring board, copper-clad laminate, electronic device, copper foil with carrier, and manufacturing method of printed wiring board Dec 17, 2015
2013-147115 Surface-treated copper foil Dec 14, 2015
2013-147116 Surface-treated copper foil Dec 14, 2015
2013-145818 Sputtering target and its manufacturing method Dec 10, 2015
2013-145849 Elution method of gold and silver adsorbed on activated carbon and recovery method of gold and silver using it Dec 10, 2015
2013-146448 Sintered body for forming a low refractive index film and its manufacturing method Dec 10, 2015
A 2015-214750 Manufacturing method of copper foil with carrier, printed wiring board, laminate, electronic device and printed wiring board Dec 3, 2015
A 2015-212076 Laminated body consisting of a resin plate-like carrier and a metal layer Nov 26, 2015
A 2015-212426 Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic equipment, semiconductor package, printed wiring board manufacturing method, resin base material manufacturing method, method of transferring the surface profile of copper foil to the resin base material, and resin base Wood Nov 26, 2015

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2013-161334 2015-232167 2015-232170 2015-229791 2015-230944 2015-227060 2015-227502 2013-147115 2013-147116 2013-145818 2013-145849 2013-146448 2015-214750 2015-212076 2015-212426

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