Patent Ranking in Japan - Applicant details - Japanese version

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JX Nippon Mining & Metals Co., Ltd.

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  2015 Application Ranking      156th  publications: 297 下降2014: 152th  300)

  2015 Acquisition Ranking      184th  registrations: 166 下降2014: 168th  260)

(update:Oct 21, 2021)

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Publication numberTitle of the InventionPublic. dateRemarks
B 5766870 Indium cylindrical sputtering target and its manufacturing method Aug 19, 2015
B 5761670 Sputtering target for forming a transparent conductive film and its manufacturing method Aug 12, 2015
B 5763178 Ferromagnetic material sputtering target with less particle generation Aug 12, 2015
B 5758033 Surface-treated copper foil and laminated boards using it, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards Aug 5, 2015
B 5758034 Surface-treated copper foil and laminated boards using it, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards Aug 5, 2015
B 5758035 Surface-treated copper foil and laminated boards using it, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards Aug 5, 2015
B 5758205 Copper foil for graphene production and graphene production method using it Aug 5, 2015
B 5758254 Rolled copper foil Aug 5, 2015
B 5759037 Indium with low α-dose or alloy containing indium Aug 5, 2015
B 5755572 Method for manufacturing bismuth anode for electrolytic refining Jul 29, 2015
B 5750393 Cu-Ga alloy sputtering target and its manufacturing method Jul 22, 2015
B 5751572 Indium with low α-dose or alloy containing indium Jul 22, 2015
B 5752536 Rolled copper foil Jul 22, 2015
B 5753115 Rolled copper foil for printed wiring boards Jul 22, 2015
B 5748928 Sputtering target and its manufacturing method Jul 15, 2015

61-75 (total:166)

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5766870 5761670 5763178 5758033 5758034 5758035 5758205 5758254 5759037 5755572 5750393 5751572 5752536 5753115 5748928

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Patent Ranking in Japan

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