JX Nippon Mining & Metals Co., Ltd.
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Publication number | Title of the Invention | Public. date | Remarks |
A 2016-222972
|
Method for manufacturing subdivided electrolytic copper, and cathode plate and electrodeposition guide used in the method. |
Dec 28, 2016 |
|
A 2016-223016
|
High-purity magnesium manufacturing method and high-purity magnesium |
Dec 28, 2016 |
|
A 2016-225300
|
Positive electrode active material for lithium-ion batteries, positive electrode for lithium-ion batteries, and lithium-ion batteries |
Dec 28, 2016 |
|
A 2016-216354
|
Oxide sintered body, its manufacturing method and raw material powder for manufacturing oxide sintered body |
Dec 22, 2016 |
|
A 2016-216786
|
Sputtering target |
Dec 22, 2016 |
|
A 2016-216828
|
High-purity In and its manufacturing method |
Dec 22, 2016 |
|
A 2016-211077
|
Titanium copper |
Dec 15, 2016 |
|
A 2016-211078
|
Cu-Ni-Si alloy and its manufacturing method |
Dec 15, 2016 |
|
A 2016-204676
|
Lithium-ion battery processing method |
Dec 8, 2016 |
|
A 2016-204757
|
Cu-Ni-Si based copper alloy |
Dec 8, 2016 |
|
A 2016-207648
|
Lithium-ion battery processing method |
Dec 8, 2016 |
|
A 2016-207723
|
Manufacturing method of copper heat dissipation material, copper foil or copper alloy foil for copper heat dissipation material, laminate, shield material, electronic device and copper heat dissipation material |
Dec 8, 2016 |
|
A 2016-207752
|
CdTe compound semiconductors and radiation detection devices using them |
Dec 8, 2016 |
|
A 2016-208041
|
Resin substrate for printed wiring board and its manufacturing method, printed wiring board and its manufacturing method, semiconductor package substrate and its manufacturing method, and copper foil for printed wiring board. |
Dec 8, 2016 |
|
A 2016-199808
|
Cu-Co-Si alloy and its manufacturing method |
Dec 1, 2016 |
|
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2016-222972 2016-223016 2016-225300 2016-216354 2016-216786 2016-216828 2016-211077 2016-211078 2016-204676 2016-204757 2016-207648 2016-207723 2016-207752 2016-208041 2016-199808
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