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JX Nippon Mining & Metals Co., Ltd.

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  2017 Application Ranking      175th  publications: 303 変わらず2016: 175th  251)

  2017 Acquisition Ranking      181th  registrations: 180 下降2016: 141th  251)

(update:Aug 12, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
B 6254306 Surface treated copper foil, copper foil with carrier, base material manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method Dec 27, 2017
B 6254357 Copper foil with carrier Dec 27, 2017
B 6254823 Nickel silicide sputtering target and manufacturing method thereof Dec 27, 2017
B 6250365 Method for concentrating rhodium and ruthenium Dec 20, 2017
B 6250450 Sputtering target/backing plate assembly Dec 20, 2017
B 6246173 Cu-Co-Ni-Si alloy for electronic parts Dec 13, 2017
B 6246174 Cu-Co-Ni-Si alloy for electronic parts Dec 13, 2017
B 6246454 Cu-Ni-Si alloy and method for producing the same Dec 13, 2017
B 6246456 Titanium copper Dec 13, 2017
B 6246486 Carrier-attached copper foil and its manufacturing method, copper-clad laminate manufacturing method and printed wiring board manufacturing method Dec 13, 2017
B 6246502 Copper alloy plate with excellent conductivity and flexural deflection coefficient Dec 13, 2017
B 6246857 Roll-shaped laminate, method for manufacturing roll-shaped laminate, method for manufacturing laminate, method for manufacturing build-up board, method for manufacturing printed wiring board, method for manufacturing electronic device Dec 13, 2017
B 6247656 Electric furnace operation method Dec 13, 2017
B 6247812 Titanium copper and method of manufacturing the same Dec 13, 2017
B 6247829 Copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate, and method for manufacturing printed wiring board Dec 13, 2017

1-15 (total:180)

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6254306 6254357 6254823 6250365 6250450 6246173 6246174 6246454 6246456 6246486 6246502 6246857 6247656 6247812 6247829

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Patent Ranking in Japan

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