Patent Ranking in Japan - Applicant details - Japanese version

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JX Nippon Mining & Metals Co., Ltd.

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  2019 Application Ranking      245th  publications: 178 下降2018: 240th  177)

  2019 Acquisition Ranking      177th  registrations: 157 下降2018: 151th  201)

(update:Sep 24, 2021)

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Publication numberTitle of the InventionPublic. dateRemarks
B 6624585 Sputtering target-backing plate assembly Dec 25, 2019
B 6626583 Semiconductor wafer and method for polishing semiconductor wafer Dec 25, 2019
B 6622103 Copper foil with carrier, laminate, printed wiring board manufacturing method, and electronic device manufacturing method Dec 18, 2019
B 6622998 Method for removing iron and aluminum from lithium-ion battery scrap and method for recovering valuable metals Dec 18, 2019
B 6617313 Copper foil for flexible printed circuit board, copper clad laminate using the same, flexible printed circuit board, and electronic device Dec 11, 2019
B 6618410 Titanium copper foil, copper products, electronic device parts and autofocus camera modules Dec 11, 2019
B 6618945 Copper alloy for electronic materials Dec 11, 2019
B 6619389 Cu-Ni-Si copper alloy Dec 11, 2019
B 6619832 Lithium-ion battery oxide-based positive electrode active material, method for producing precursor of oxide-based positive-electrode active material for lithium-ion battery, method for producing oxide-based positive-electrode active material for lithium-ion battery, positive electrode for lithium-ion battery and lithium ion battery Dec 11, 2019
B 6619942 Copper Anode or Phosphorus-Containing Copper Anode Used for Electrolytic Copper Plating on Semiconductor Wafer and Method for Producing Copper Anode or Phosphorus-Containing Copper Anode Dec 11, 2019
B 6620266 Tantalum chloride and method for producing tantalum chloride Dec 11, 2019
B 6611751 Rolled copper foil for lithium-ion battery current collector and lithium-ion battery Nov 27, 2019
B 6611770 Method for producing low-temperature sinterable surface-treated fine copper particles Nov 27, 2019
B 6612168 Copper foil, copper clad laminate, flexible printed circuit board and electronic equipment Nov 27, 2019
B 6609589 High strength titanium copper strips and foils with layered structure Nov 20, 2019

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6624585 6626583 6622103 6622998 6617313 6618410 6618945 6619389 6619832 6619942 6620266 6611751 6611770 6612168 6609589

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Patent Ranking in Japan

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