Patent Ranking in Japan - Applicant details - Japanese version

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JX Nippon Mining & Metals Co., Ltd.

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  2019 Application Ranking      245th  publications: 178 下降2018: 240th  177)

  2019 Acquisition Ranking      177th  registrations: 157 下降2018: 151th  201)

(update:Dec 2, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
B 6624585 Sputtering target-backing plate assembly Dec 25, 2019
B 6626583 Semiconductor wafer and method for polishing semiconductor wafer Dec 25, 2019
B 6622103 Copper foil with carrier, laminate, printed wiring board manufacturing method, and electronic device manufacturing method Dec 18, 2019
B 6622998 Method for removing iron and aluminum from lithium-ion battery scrap and method for recovering valuable metals Dec 18, 2019
B 6617313 Copper foil for flexible printed circuit board, copper clad laminate using the same, flexible printed circuit board, and electronic device Dec 11, 2019
B 6618410 Titanium copper foil, copper products, electronic device parts and autofocus camera modules Dec 11, 2019
B 6618945 Copper alloy for electronic materials Dec 11, 2019
B 6619389 Cu-Ni-Si copper alloy Dec 11, 2019
B 6619832 Lithium-ion battery oxide-based positive electrode active material, method for producing precursor of oxide-based positive-electrode active material for lithium-ion battery, method for producing oxide-based positive-electrode active material for lithium-ion battery, positive electrode for lithium-ion battery and lithium ion battery Dec 11, 2019
B 6619942 Copper Anode or Phosphorus-Containing Copper Anode Used for Electrolytic Copper Plating on Semiconductor Wafer and Method for Producing Copper Anode or Phosphorus-Containing Copper Anode Dec 11, 2019
B 6620266 Tantalum chloride and method for producing tantalum chloride Dec 11, 2019
B 6611751 Rolled copper foil for lithium-ion battery current collector and lithium-ion battery Nov 27, 2019
B 6611770 Method for producing low-temperature sinterable surface-treated fine copper particles Nov 27, 2019
B 6612168 Copper foil, copper clad laminate, flexible printed circuit board and electronic equipment Nov 27, 2019
B 6609589 High strength titanium copper strips and foils with layered structure Nov 20, 2019

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6624585 6626583 6622103 6622998 6617313 6618410 6618945 6619389 6619832 6619942 6620266 6611751 6611770 6612168 6609589

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Patent Ranking in Japan

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Applicant Search (Japanese only)

今週の知財セミナー (11月28日~12月4日)

来週の知財セミナー (12月5日~12月11日)

12月6日(火) - 東京 港区

発明の創出・拡げ方(電気・機械)

12月7日(水) - 東京 港区

特許発明の書き方(電気・機械)

12月8日(木) - 東京 港区

はじめての特許情報分析

12月6日(火) - 東京 港区

発明の創出・拡げ方(電気・機械)

特許事務所紹介 IP Force 特許事務所紹介

特許業務法人 浅村特許事務所 (東京都品川区)

〒140-0002 東京都品川区東品川2丁目2番24号 天王洲セントラルタワー21F・22F 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング 

あいわ特許業務法人(特許事務所)

〒104-0045 東京都中央区築地1-12-22 コンワビル4F 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング 

知財テラス特許事務所 名古屋事務所

愛知県名古屋市中区平和一丁目15-30 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング