JX Nippon Mining & Metals Co., Ltd.
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Publication number | Title of the Invention | Public. date | Remarks |
B 6804854
|
Cu-Ni-Co-Si based copper alloy and its manufacturing method |
Dec 23, 2020 |
|
B 6805217
|
Conductive materials, molded products and electronic components |
Dec 23, 2020 |
|
B 6805382
|
Electromagnetic wave shield material |
Dec 23, 2020 |
|
B 6800580
|
Fe-Co based alloy sputtering target |
Dec 16, 2020 |
|
B 6801090
|
Lithium-ion battery scrap disposal method |
Dec 16, 2020 |
|
B 6796845
|
Peptides that bind to arsenic-containing minerals and their uses |
Dec 9, 2020 |
|
B 6796943
|
Titanium copper foil with plating layer |
Dec 9, 2020 |
|
B 6797513
|
Surface-treated metal powder for 3D printers using electron beam method and its manufacturing method |
Dec 9, 2020 |
|
B 6798918
|
Lithium-ion battery scrap disposal method |
Dec 9, 2020 |
|
B 6793138
|
Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices |
Dec 2, 2020 |
|
B 6796103
|
Zirconium tungate and its manufacturing method |
Dec 2, 2020 |
|
B 6790153
|
A method for manufacturing a rolled copper foil for a secondary battery negative electrode current collector, a secondary battery negative electrode current collector and a secondary battery using the rolled copper foil, and a rolled copper foil for a secondary battery negative electrode current collector. |
Nov 25, 2020 |
|
B 6791726
|
Processing method |
Nov 25, 2020 |
|
B 6787832
|
Manufacturing method of strip metal material |
Nov 18, 2020 |
|
B 6782561
|
Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment |
Nov 11, 2020 |
|
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6804854 6805217 6805382 6800580 6801090 6796845 6796943 6797513 6798918 6793138 6796103 6790153 6791726 6787832 6782561
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