Patent Ranking in Japan - Applicant details - Japanese version

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JX Nippon Mining & Metals Co., Ltd.

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  2021 Application Ranking      291th  publications: 132 下降2020: 211th  202)

  2021 Acquisition Ranking      246th  registrations: 117 下降2020: 231th  124)

(update:Nov 28, 2022)

2011  2012  2013  2014  2015  2016  2017  2018  2019  2020  2022 

Publication numberTitle of the InventionPublic. dateRemarks
B 6873087 Stable dischargeable sputtering target May 19, 2021
B 6869237 Sputtering target and its manufacturing method May 12, 2021
B 6869274 Conductive coating material May 12, 2021
B 6869275 Conductive coating material May 12, 2021
B 6869304 Insert molded product and manufacturing method of insert molded product May 12, 2021
B 6865925 Virus composition and isolation method using it Apr 28, 2021
B 6866408 Surface-treated metal powder and conductive composition Apr 28, 2021
B 6867102 Manufacturing method of copper heat dissipation material, copper foil with carrier, connector, terminal, laminate, shield material, printed wiring board, metal processing member, electronic device, and printed wiring board Apr 28, 2021
B 6858365 Manufacturing method of gas flow sputtering equipment, gas flow sputtering target and sputtering target raw material Apr 14, 2021
B 6858607 Method for preparing analytical sample and method for analyzing powder or granular material sample Apr 14, 2021
B 6859151 How to dispose of scraps of electronic and electrical equipment parts Apr 14, 2021
B 6859159 How to operate the kiln stoker Apr 14, 2021
B 6854114 Surface-treated copper foil Apr 7, 2021
B 6854306 Sputtering target-backing plate joint Apr 7, 2021
B 6856688 Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices Apr 7, 2021

76-90 (total:119)

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6873087 6869237 6869274 6869275 6869304 6865925 6866408 6867102 6858365 6858607 6859151 6859159 6854114 6854306 6856688

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Patent Ranking in Japan

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