Patent Ranking in Japan - Applicant details - Japanese version

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ULVAC, Inc.

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  2017 Application Ranking      327th  publications: 135 上昇2016: 499th  67)

  2017 Acquisition Ranking      348th  registrations: 80 下降2016: 236th  145)

(update:May 24, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
2017-51820 Sputtering target, target manufacturing method Sep 21, 2017
2016-88721 Board monitoring device and board monitoring method Sep 14, 2017
A 2017-160319 Conductive metal ink for letterpress reversal printing Sep 14, 2017
2017-38961 Deep ultraviolet LED and manufacturing method thereof Sep 7, 2017
A 2017-155282 Film deposition equipment, platen ring Sep 7, 2017
2016-136121 Rotary cathode unit for magnetron sputtering equipment Aug 31, 2017
2017-38806 Oxide Dielectric Device and Method for Manufacturing Oxide Dielectric Device Aug 31, 2017
A 2017-150054 Circuit board manufacturing method, circuit board with protective film and electrical equipment Aug 31, 2017
A 2017-150937 Board inspection equipment and sluice valve equipment Aug 31, 2017
A 2017-144455 Welding method and welding equipment Aug 24, 2017
A 2017-147837 Power supply device, vacuum processing device Aug 24, 2017
2017-29771 Sputtering device and its state determination method Aug 17, 2017
A 2017-140651 Member joining method Aug 17, 2017
A 2017-141509 Target assembly, manufacturing method of target assembly, separation method of target and backing plate Aug 17, 2017
2016-88284 Target assembly Aug 10, 2017

31-45 (total:139)

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2017-51820 2016-88721 2017-160319 2017-38961 2017-155282 2016-136121 2017-38806 2017-150054 2017-150937 2017-144455 2017-147837 2017-29771 2017-140651 2017-141509 2016-88284

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