Patent Ranking in Japan - Applicant details - Japanese version

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ULVAC, Inc.

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  2019 Application Ranking      252th  publications: 173 上昇2018: 362th  104)

  2019 Acquisition Ranking      282th  registrations: 100 上昇2018: 328th  87)

(update:Aug 9, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
A 2019-218581 Sputtering device, sputtering method Dec 26, 2019
A 2019-218603 Film forming apparatus and film forming method Dec 26, 2019
A 2019-218604 Film forming device and sputtering target mechanism Dec 26, 2019
A 2019-218605 Film forming apparatus, cleaning gas nozzle, cleaning method Dec 26, 2019
A 2019-218620 Aluminum surface treatment method Dec 26, 2019
A 2019-219338 Transducer type vacuum gauge Dec 26, 2019
A 2019-220647 Surface treatment method, printed wiring board manufacturing method, and surface treatment apparatus Dec 26, 2019
A 2019-214746 Device for growing carbon nanostructures Dec 19, 2019
A 2019-214766 Deposition source for vacuum deposition equipment Dec 19, 2019
A 2019-214767 Deposition source for vacuum deposition equipment Dec 19, 2019
A 2019-215195 BA type ionization vacuum gauge and its sensitivity abnormality detection method, and pressure measurement method using BA type ionization vacuum gauge Dec 19, 2019
A 2019-216281 Thin film transistor, oxide semiconductor film, and sputtering target Dec 19, 2019
2019-87724 Sputtering apparatus and film forming method Dec 12, 2019
A 2019-210517 Sputtering apparatus and film forming method Dec 12, 2019
A 2019-210525 Deposition plate and sputter device Dec 12, 2019

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2019-218581 2019-218603 2019-218604 2019-218605 2019-218620 2019-219338 2019-220647 2019-214746 2019-214766 2019-214767 2019-215195 2019-216281 2019-87724 2019-210517 2019-210525

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