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Ibiden Co., Ltd.

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  2014 Application Ranking      297th  publications: 135 上昇2013: 395th  105)

  2014 Acquisition Ranking      856th  registrations: 34 下降2013: 399th  90)

(update:May 6, 2021)

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公報番号発明の名称公報発行日備考
特開 2014-236029 Printed wiring board and method for manufacturing printed wiring board Dec 15, 2014
特開 2014-236187 Wiring board and manufacturing method thereof Dec 15, 2014
特開 2014-236188 Wiring board and manufacturing method thereof Dec 15, 2014
特開 2014-233920 Holding sealing material, manufacturing method of holding sealing material, exhaust gas purifying apparatus, and manufacturing method of exhaust gas purifying apparatus Dec 15, 2014
特開 2014-232812 Printed wiring board and manufacturing method thereof Dec 11, 2014
特開 2014-232837 Wiring board Dec 11, 2014
特開 2014-229698 Wiring board and method of manufacturing wiring board Dec 8, 2014
特開 2014-225521 Printed wiring board Dec 4, 2014
特開 2014-222733 Printed wiring board and manufacturing method thereof Nov 27, 2014
特開 2014-220366 Electronic component built-in wiring board and method for manufacturing electronic component built-in wiring board Nov 20, 2014
特開 2014-216375 Method for manufacturing printed wiring board and multilayer core substrate Nov 17, 2014
特開 2014-216377 Electronic component, manufacturing method thereof, and manufacturing method of multilayer printed wiring board Nov 17, 2014
特開 2014-216478 Printed wiring board and method for manufacturing printed wiring board Nov 17, 2014
特開 2014-212259 Multilayer printed wiring board and manufacturing method thereof Nov 13, 2014
特開 2014-211366 Manufacturing method of honeycomb structure Nov 13, 2014

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2014-236029 2014-236187 2014-236188 2014-233920 2014-232812 2014-232837 2014-229698 2014-225521 2014-222733 2014-220366 2014-216375 2014-216377 2014-216478 2014-212259 2014-211366

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