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Ibiden Co., Ltd.
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■ 2014 Application Ranking 297th publications: 135
（
2013: 395th 105）
■ 2014 Acquisition Ranking 856th registrations: 34
（
2013: 399th 90）
（update：May 6, 2021）
| 公報番号 | 発明の名称 | 公報発行日 | 備考 |
|---|---|---|---|
| 特開 2014-236029 | Printed wiring board and method for manufacturing printed wiring board | Dec 15, 2014 | |
| 特開 2014-236187 | Wiring board and manufacturing method thereof | Dec 15, 2014 | |
| 特開 2014-236188 | Wiring board and manufacturing method thereof | Dec 15, 2014 | |
| 特開 2014-233920 | Holding sealing material, manufacturing method of holding sealing material, exhaust gas purifying apparatus, and manufacturing method of exhaust gas purifying apparatus | Dec 15, 2014 | |
| 特開 2014-232812 | Printed wiring board and manufacturing method thereof | Dec 11, 2014 | |
| 特開 2014-232837 | Wiring board | Dec 11, 2014 | |
| 特開 2014-229698 | Wiring board and method of manufacturing wiring board | Dec 8, 2014 | |
| 特開 2014-225521 | Printed wiring board | Dec 4, 2014 | |
| 特開 2014-222733 | Printed wiring board and manufacturing method thereof | Nov 27, 2014 | |
| 特開 2014-220366 | Electronic component built-in wiring board and method for manufacturing electronic component built-in wiring board | Nov 20, 2014 | |
| 特開 2014-216375 | Method for manufacturing printed wiring board and multilayer core substrate | Nov 17, 2014 | |
| 特開 2014-216377 | Electronic component, manufacturing method thereof, and manufacturing method of multilayer printed wiring board | Nov 17, 2014 | |
| 特開 2014-216478 | Printed wiring board and method for manufacturing printed wiring board | Nov 17, 2014 | |
| 特開 2014-212259 | Multilayer printed wiring board and manufacturing method thereof | Nov 13, 2014 | |
| 特開 2014-211366 | Manufacturing method of honeycomb structure | Nov 13, 2014 |
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2014-236029 2014-236187 2014-236188 2014-233920 2014-232812 2014-232837 2014-229698 2014-225521 2014-222733 2014-220366 2014-216375 2014-216377 2014-216478 2014-212259 2014-211366
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