Patent Ranking in Japan - Applicant details - Japanese version

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Dow Global Technologies LLC

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  2021 Application Ranking      206th  publications: 145 下降2020: 186th  229)

  2021 Acquisition Ranking      115th  registrations: 182 上昇2020: 163th  179)

(update:Sep 24, 2021)

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Publication numberTitle of the InventionPublic. dateRemarks
B 6936793 Coating composition Sep 22, 2021
B 6936795 Crosslinkable polymer compositions for flexible crosslinked cable insulators, and methods for making flexible crosslinked cable insulators. Sep 22, 2021
B 6936810 Process for producing polymer polyols with monodisperse dispersed polymer particles Sep 22, 2021
B 6936853 Solvent system for the synthesis of poly (amidic acid) polymers and polyimide polymers Sep 22, 2021
B 6937298 High-pressure free radical polymerization to produce ethylene-based polymers Sep 22, 2021
B 6938386 Process for sealing flexible appendages to flexible film Sep 22, 2021
B 6934536 Aqueous adhesive composition Sep 15, 2021
B 6935398 High pressure free radical polymerization Sep 15, 2021
B 6936244 Adhesive formulation for laminating containing polyurethane and latent catalyst Sep 15, 2021
B 6936255 Foam control agent and its composition Sep 15, 2021
B 6932713 Modified polyethylene resin and method for producing it Sep 8, 2021
B 6927889 High-pressure free radical polymerization process with flexible adjustment of molecular weight distribution Sep 1, 2021
B 6927891 Epoxy resin system with stable high glass transition temperature for producing composite materials Sep 1, 2021
B 6929416 Compositions and manufactured articles containing the compositions Sep 1, 2021
B 6924255 Aqueous pressure-sensitive adhesive composition and its manufacturing method Aug 25, 2021

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6936793 6936795 6936810 6936853 6937298 6938386 6934536 6935398 6936244 6936255 6932713 6927889 6927891 6929416 6924255

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Patent Ranking in Japan

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