Patent Ranking in Japan - Applicant details - Japanese version

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Qualcomm Incorporated

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  2019 Application Ranking      155th  publications: 309 下降2018: 40th  836)

  2019 Acquisition Ranking      41th  registrations: 617 下降2018: 28th  840)

(update:Aug 12, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
2019-537841 Separate chip solution for die-to-die SerDes Dec 26, 2019
2019-537871 Configurator key package for Device Provisioning Protocol (DPP) Dec 26, 2019
2019-537140 Vehicle collision avoidance Dec 19, 2019
2019-537377 Device and method for sensing distributed load current provided by a power gating circuit Dec 19, 2019
A 2019-215545 System and method for communicating redundant frame information Dec 19, 2019
A 2019-216437 Method and apparatus for lightweight messaging during initial synchronization, discovery, and association in a directional wireless system Dec 19, 2019
A 2019-216440 Techniques for allocating resources in low latency wireless communications Dec 19, 2019
A 2019-216444 Techniques for constructing preamble and overhead signals for transmission in the unlicensed radio frequency spectrum band Dec 19, 2019
2019-536285 Adaptive multi-tier power distribution grid for integrated circuits Dec 12, 2019
2019-535032 System and method for reducing actuator power leakage Dec 5, 2019
2019-535198 System and method for switching interpolation filters Dec 5, 2019
A 2019-208224 System and method for transmitting data payload in WB SC, aggregate SC, duplicate SC, OFDM transmission frame Dec 5, 2019
A 2019-208227 Uplink channel design with coverage extension Dec 5, 2019
A 2019-208232 EPDCCH resource and pseudo-collocation management in LTE (registered trademark) Dec 5, 2019
A 2019-208237 Method and apparatus for increasing reuse in wireless communications Dec 5, 2019

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2019-537841 2019-537871 2019-537140 2019-537377 2019-215545 2019-216437 2019-216440 2019-216444 2019-536285 2019-535032 2019-535198 2019-208224 2019-208227 2019-208232 2019-208237

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