Patent Ranking in Japan - Applicant details - Japanese version

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Mitsubishi Materials Corporation

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  2018 Application Ranking      128th  publications: 349 上昇2017: 131th  405)

  2018 Acquisition Ranking      113th  registrations: 267 下降2017: 112th  287)

(update:Sep 16, 2021)

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Publication numberTitle of the InventionPublic. dateRemarks
A 2018-202774 Paste embedded printing device Dec 27, 2018
A 2018-203552 High durability and fast hardening concrete composition Dec 27, 2018
A 2018-203579 Chlorosilanes recovery method and chlorosilanes recovery device Dec 27, 2018
A 2018-204102 Method for producing high-purity electrolytic copper Dec 27, 2018
A 2018-204103 High purity electrolytic copper Dec 27, 2018
A 2018-206953 Solder bump forming method and solder paste Dec 27, 2018
A 2018-199152 Powder molding press method and powder molding press device for green compact for cutting insert Dec 20, 2018
A 2018-199853 Powder molding press method and powder molding press device for green compact for cutting insert Dec 20, 2018
A 2018-200244 Abnormal temperature detection circuit Dec 20, 2018
A 2018-197397 Rolled copper plate and parts for electronic and electrical equipment Dec 13, 2018
A 2018-193578 Tin-plated copper terminal material and terminal, and wire end structure Dec 6, 2018
A 2018-193584 Copper porous body, copper porous composite member, method for producing copper porous body, and method for producing copper porous composite member Dec 6, 2018
A 2018-195995 Antenna device Dec 6, 2018
A 2018-187861 W-Ti laminated film Nov 29, 2018
A 2018-188358 Method for modifying coal ash and method for producing fly ash for concrete admixture Nov 29, 2018

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2018-202774 2018-203552 2018-203579 2018-204102 2018-204103 2018-206953 2018-199152 2018-199853 2018-200244 2018-197397 2018-193578 2018-193584 2018-195995 2018-187861 2018-188358

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Patent Ranking in Japan

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