Patent Ranking in Japan - Applicant details - Japanese version

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DISCO Corporation

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  2017 Application Ranking      89th  publications: 553 下降2016: 77th  532)

  2017 Acquisition Ranking      68th  registrations: 420 下降2016: 61th  459)

(update:Dec 1, 2021)

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Publication numberTitle of the InventionPublic. dateRemarks
A 2017-226046 Grinding machine Dec 28, 2017
A 2017-226057 Cutting wheel Dec 28, 2017
A 2017-227532 Fluorescence detector Dec 28, 2017
A 2017-228561 Cutting equipment Dec 28, 2017
A 2017-228615 Processing equipment Dec 28, 2017
A 2017-228617 Workpiece holding mechanism and processing device Dec 28, 2017
A 2017-228634 Wafer detection method for detecting outer peripheral position of wafer and processing apparatus capable of detecting outer peripheral position of wafer Dec 28, 2017
A 2017-228651 Wafer processing method Dec 28, 2017
A 2017-228653 Cutting method and cutting device Dec 28, 2017
A 2017-228680 Grinding machine Dec 28, 2017
A 2017-228723 Protective film coating device and protective film coating method Dec 28, 2017
A 2017-228732 Wafer processing method Dec 28, 2017
A 2017-221989 Blade case Dec 21, 2017
A 2017-221994 Mounting flange end face correction method and cutting device Dec 21, 2017
A 2017-222003 Spindle unit Dec 21, 2017

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2017-226046 2017-226057 2017-227532 2017-228561 2017-228615 2017-228617 2017-228634 2017-228651 2017-228653 2017-228680 2017-228723 2017-228732 2017-221989 2017-221994 2017-222003

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