Patent Ranking in Japan - Applicant details - Japanese version

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DISCO Corporation

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  2017 Application Ranking      89th  publications: 553 下降2016: 77th  532)

  2017 Acquisition Ranking      68th  registrations: 420 下降2016: 61th  459)

(update:Nov 25, 2021)

2011  2012  2013  2014  2015  2016  2018  2019  2020  2021 

Publication numberTitle of the InventionPublic. dateRemarks
B 6244148 Processing equipment Dec 6, 2017
B 6244206 Grinding device Dec 6, 2017
B 6244248 Cutting equipment Dec 6, 2017
B 6233936 How to split a wafer into dies Nov 22, 2017
B 6234066 Processing equipment Nov 22, 2017
B 6234161 Adhesive tape sticking device Nov 22, 2017
B 6234250 Dressing tool Nov 22, 2017
B 6234312 Laminated board processing method Nov 22, 2017
B 6235279 Wafer processing method Nov 22, 2017
B 6235396 Wafer processing method Nov 22, 2017
B 6236348 Processing method Nov 22, 2017
B 6230354 Device wafer processing method Nov 15, 2017
B 6230381 Processing method Nov 15, 2017
B 6230422 Wafer processing method Nov 15, 2017
B 6230477 Cutting equipment Nov 15, 2017

31-45 (total:420)

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6244148 6244206 6244248 6233936 6234066 6234161 6234250 6234312 6235279 6235396 6236348 6230354 6230381 6230422 6230477

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Patent Ranking in Japan

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海嶺知財経営コンサルタント事務所

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