Patent Ranking in Japan - Applicant details - Japanese version

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DISCO Corporation

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  2018 Application Ranking      46th  publications: 777 上昇2017: 89th  553)

  2018 Acquisition Ranking      81th  registrations: 363 下降2017: 68th  420)

(update:Oct 27, 2021)

2011  2012  2013  2014  2015  2016  2017  2019  2020  2021 

Publication numberTitle of the InventionPublic. dateRemarks
B 6444207 Hexagonal single crystal substrate inspection method and inspection device Dec 26, 2018
B 6444230 How to replace the cutting blade Dec 26, 2018
B 6444247 Cutting equipment Dec 26, 2018
B 6444249 Wafer generation method Dec 26, 2018
B 6440309 Cutting equipment Dec 19, 2018
B 6440558 Processing method of work piece Dec 19, 2018
B 6440560 Corrector Dec 19, 2018
B 6440977 Laser processing equipment Dec 19, 2018
B 6441056 Grinding machine Dec 19, 2018
B 6441704 Cutting equipment Dec 19, 2018
B 6441731 Laser processing equipment Dec 19, 2018
B 6441737 Cutting equipment Dec 19, 2018
B 6438304 Wafer processing method Dec 12, 2018
B 6433178 Processing equipment Dec 5, 2018
B 6433204 Electrostatic support plate and method of manufacturing electrostatic support plate Dec 5, 2018

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6444207 6444230 6444247 6444249 6440309 6440558 6440560 6440977 6441056 6441704 6441731 6441737 6438304 6433178 6433204

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Patent Ranking in Japan

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あいわ特許業務法人(特許事務所)

〒104-0045 東京都中央区築地1-12-22 コンワビル4F 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング 

福井特許事務所

〒166-0003 東京都杉並区高円寺南2-50-2 YSビル3F 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング 

IPボランチ国際特許事務所

東京都武蔵野市吉祥寺本町1丁目35-14-202 特許・実用新案 意匠 商標 外国特許 鑑定 コンサルティング