Patent Ranking in Japan - Applicant details - Japanese version

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DISCO Corporation

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  2018 Application Ranking      46th  publications: 777 上昇2017: 89th  553)

  2018 Acquisition Ranking      81th  registrations: 363 下降2017: 68th  420)

(update:Sep 16, 2021)

2011  2012  2013  2014  2015  2016  2017  2019  2020  2021 

Publication numberTitle of the InventionPublic. dateRemarks
B 6415299 Cutting equipment Oct 31, 2018
B 6415349 Wafer alignment method Oct 31, 2018
B 6417115 Vibration damping mechanism and grinding equipment Oct 31, 2018
B 6417227 Machining method for cutting blades, cutting equipment and wafers Oct 31, 2018
B 6417236 Wafer division method and chuck table Oct 31, 2018
B 6410490 Evaluation method of device wafer Oct 24, 2018
B 6410541 Blade cover device Oct 24, 2018
B 6410619 Pure water purification equipment Oct 24, 2018
B 6410626 Cutting equipment Oct 24, 2018
B 6411142 Protective coating method Oct 24, 2018
B 6411822 Laser processing equipment Oct 24, 2018
B 6411866 Displacement detector Oct 24, 2018
B 6406956 Cutting equipment Oct 17, 2018
B 6407056 Dividing device and dividing method Oct 17, 2018
B 6407066 Manufacturing method of optical device chip Oct 17, 2018

46-60 (total:364)

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6415299 6415349 6417115 6417227 6417236 6410490 6410541 6410619 6410626 6411142 6411822 6411866 6406956 6407056 6407066

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Patent Ranking in Japan

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特許業務法人 牛木国際特許事務所

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京都市伏見区深草大亀谷万帖敷町446-2 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング