Patent Ranking in Japan - Applicant details - Japanese version

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DISCO Corporation

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  2020 Application Ranking      37th  publications: 858 上昇2019: 47th  747)

  2020 Acquisition Ranking      77th  registrations: 338 上昇2019: 85th  313)

(update:Aug 12, 2022)

2011  2012  2013  2014  2015  2016  2017  2018  2019  2021  2022 

Publication numberTitle of the InventionPublic. dateRemarks
B 6803169 Grinding method Dec 23, 2020
B 6803171 Grinding equipment and processing equipment Dec 23, 2020
B 6803187 Grinding wheel dressing method Dec 23, 2020
B 6804146 Transport equipment, processing equipment and transport method Dec 23, 2020
B 6804154 Package substrate processing method and cutting equipment Dec 23, 2020
B 6799467 Wafer processing method Dec 16, 2020
B 6799470 Spot shape detector Dec 16, 2020
B 6800520 Cutting equipment Dec 16, 2020
B 6800521 Cutting equipment Dec 16, 2020
B 6800523 Package substrate processing method Dec 16, 2020
B 6800524 How to maintain chip spacing Dec 16, 2020
B 6800535 Block gauge jig and extrusion device Dec 16, 2020
B 6800689 Chuck table mechanism Dec 16, 2020
B 6800745 Semiconductor package manufacturing method Dec 16, 2020
B 6800763 Alignment device Dec 16, 2020

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6803169 6803171 6803187 6804146 6804154 6799467 6799470 6800520 6800521 6800523 6800524 6800535 6800689 6800745 6800763

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Patent Ranking in Japan

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