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Sumitomo Bakelite Co., Ltd.

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  2014 Application Ranking      136th  publications: 331 下降2013: 108th  448)

  2014 Acquisition Ranking      127th  registrations: 331 下降2013: 125th  332)

(update:Sep 24, 2020)

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公報番号発明の名称公報発行日備考
特開 2014-240456 Prepreg with primer layer, metal-clad laminate, printed wiring board and semiconductor package Dec 25, 2014
特開 2014-240784 Sample holder Dec 25, 2014
特開 2014-237811 Adhesive film, adhesive sheet, adhesive film with integrated dicing sheet, adhesive film with integrated back grind tape, adhesive film with integrated dicing sheet and back grind tape, and semiconductor device Dec 18, 2014
特開 2014-236090 Printed wiring board and semiconductor device Dec 15, 2014
特開 2014-233482 High frequency treatment tool Dec 15, 2014
特開 2014-232854 Semiconductor device Dec 11, 2014
特開 2014-232232 Photosensitive resin composition and electronic device Dec 11, 2014
特開 2014-231593 Release film and method of using release film Dec 11, 2014
特開 2014-232233 Photosensitive resin composition and electronic device Dec 11, 2014
特開 2014-226620 Thin film forming method and thin film Dec 8, 2014
特開 2014-229775 Printed wiring board, semiconductor package, semiconductor device, and printed wiring board manufacturing method Dec 8, 2014
特開 2014-223592 Method for producing film with resin Dec 4, 2014
特開 2014-225662 Photosensitive adhesive composition and semiconductor device Dec 4, 2014
特開 2014-225019 Optical waveguide, optical wiring, opto-electric hybrid board and electronic equipment Dec 4, 2014
特開 2014-224201 Prepreg manufacturing method Dec 4, 2014

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2014-240456 2014-240784 2014-237811 2014-236090 2014-233482 2014-232854 2014-232232 2014-231593 2014-232233 2014-226620 2014-229775 2014-223592 2014-225662 2014-225019 2014-224201

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角田特許事務所

〒130-0022 東京都墨田区江東橋4-24-5 協新ビル402 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング 

ボングゥー特許商標事務所

〒120-0034 東京都足立区千住1-19-8 仁生堂B 2階 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング 

あいわ特許業務法人(特許事務所)

〒104-0045 東京都中央区築地1-12-22 コンワビル4F 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング