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Toyoda Gosei Co., Ltd.

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  2014 Application Ranking      167th  publications: 276 上昇2013: 198th  246)

  2014 Acquisition Ranking      173th  registrations: 254 下降2013: 114th  366)

(update:Dec 2, 2021)

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公報番号発明の名称公報発行日備考
特開 2014-240335 Group III nitride semiconductor etching method, group III nitride semiconductor crystal manufacturing method, and GaN substrate manufacturing method Dec 25, 2014
特開 2014-237409 Side airbag device Dec 18, 2014 共同出願
特開 2014-237410 Side airbag device Dec 18, 2014 共同出願
特開 2014-237411 Side airbag device Dec 18, 2014 共同出願
特開 2014-237568 Group III nitride semiconductor crystal manufacturing method and GaN substrate manufacturing method Dec 18, 2014
特開 2014-236089 Method for manufacturing semiconductor device and semiconductor device Dec 15, 2014
特開 2014-234324 Group III nitride semiconductor manufacturing method and group III nitride semiconductor Dec 15, 2014
特開 2014-233980 Airbag device Dec 15, 2014
特開 2014-236088 Semiconductor device and method of manufacturing semiconductor device Dec 15, 2014
特開 2014-236094 Method for manufacturing semiconductor device and semiconductor device Dec 15, 2014
特開 2014-232859 Semiconductor device and manufacturing method thereof Dec 11, 2014
特開 2014-231241 Duct equipment Dec 11, 2014
特開 2014-232788 Electrode, MIS semiconductor device, and method of manufacturing electrode Dec 11, 2014
特開 2014-229415 Current-carrying member Dec 8, 2014
特開 2014-224602 Liner for pressure vessel, its mold, and pressure vessel Dec 4, 2014 共同出願

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2014-240335 2014-237409 2014-237410 2014-237411 2014-237568 2014-236089 2014-234324 2014-233980 2014-236088 2014-236094 2014-232859 2014-231241 2014-232788 2014-229415 2014-224602

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