Patent Ranking in Japan - Applicant details - Japanese version

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Lintec Co., Ltd.

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  2019 Application Ranking      170th  publications: 280 下降2018: 152th  280)

  2019 Acquisition Ranking      133th  registrations: 219 下降2018: 119th  252)

(update:Jul 1, 2022)

2011  2012  2013  2014  2015  2016  2017  2018  2020  2021  2022 

Publication numberTitle of the InventionPublic. dateRemarks
B 6626998 Gas barrier pressure-sensitive adhesive sheet, method for producing the same, electronic member and optical member Dec 25, 2019
B 6622461 Sheet manufacturing equipment Dec 18, 2019
B 6623098 Adhesive sheet for glass dicing and method for producing the same Dec 18, 2019
B 6623210 Method for manufacturing dicing sheet and semiconductor chip Dec 18, 2019
B 6617215 Dicing sheet Dec 11, 2019
B 6619200 Release film for ceramic green sheet manufacturing process Dec 11, 2019
B 6619259 Adhesive film and manufacturing method thereof Dec 11, 2019
B 6619596 Adhesive sheet Dec 11, 2019
B 6613516 Surface protection film Dec 4, 2019
B 6613522 Adhesive composition, film adhesive, and method for producing laminated body Dec 4, 2019
B 6614669 Adhesive sheet Dec 4, 2019
B 6614670 Adhesive sheet Dec 4, 2019
B 6614865 Sheet pasting device and sheet pasting method Dec 4, 2019
B 6614879 Support device and support method Dec 4, 2019
B 6616558 Adhesive tape for semiconductor processing and method for manufacturing semiconductor device Dec 4, 2019

1-15 (total:219)

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6626998 6622461 6623098 6623210 6617215 6619200 6619259 6619596 6613516 6613522 6614669 6614670 6614865 6614879 6616558

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Patent Ranking in Japan

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〒460-0003 愛知県名古屋市中区錦1-20-19 名神ビル2F 〒107-0052 東京都港区赤坂2-2-21 永田町法曹ビル9F(東京支店) 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング