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Hitachi Chemical Company, Ltd.

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  2013 Application Ranking      82th  publications: 562 上昇2012:   0)

  2013 Acquisition Ranking      95th  registrations: 431 上昇2012:   0)

(update:Aug 16, 2022)

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公報番号発明の名称公報発行日備考
特許 5374983 Method of manufacturing semiconductor device Dec 25, 2013
特許 5374972 Adhesive film, adhesive sheet, semiconductor device, and method for manufacturing semiconductor device Dec 25, 2013
特許 5376075 Prepreg manufacturing method and prepreg manufacturing apparatus Dec 25, 2013
特許 5374969 Adhesive film, adhesive sheet, semiconductor device, and method for manufacturing semiconductor device Dec 25, 2013
特許 5376043 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method and printed wiring board manufacturing method Dec 25, 2013
特許 5374982 Manufacturing method of semiconductor devices Dec 25, 2013
特許 5376014 A thermosetting resin composition for light reflection, a substrate for mounting an optical semiconductor using the same, a method for producing the same, and an optical semiconductor device. Dec 25, 2013
特許 5378261 Adhesive for connecting circuit members Dec 25, 2013
特許 5375961 Crosslinked polymer particles, method for producing the same, and conductive particles Dec 25, 2013
特許 5374971 Adhesive film, adhesive sheet, semiconductor device, and method for manufacturing semiconductor device Dec 25, 2013
特許 5374970 Method of manufacturing semiconductor device Dec 25, 2013
特許 5375374 Circuit connection material and circuit connection structure Dec 25, 2013
特許 5374891 Method for producing resin varnish containing thermosetting resin of semi-IPN type composite, resin varnish for printed wiring board, prepreg and metal-clad laminate Dec 25, 2013
特許 5374818 Liquid epoxy resin composition for encapsulation, electronic component device and wafer level chip size package Dec 25, 2013
特許 5375025 Polishing liquid Dec 25, 2013

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5374983 5374972 5376075 5374969 5376043 5374982 5376014 5378261 5375961 5374971 5374970 5375374 5374891 5374818 5375025

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