Patent Ranking in Japan - Applicant details - Japanese version

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Hitachi Chemical Company, Ltd.

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  2016 Application Ranking      57th  publications: 653 上昇2015: 64th  617)

  2016 Acquisition Ranking      66th  registrations: 432 変わらず2015: 66th  381)

(update:Aug 4, 2021)

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Publication numberTitle of the InventionPublic. dateRemarks
B 6051520 Integrated dicing/die bonding tape and method for manufacturing semiconductor device Dec 27, 2016
B 6051557 Epoxy resin liquid encapsulant for underfill and electronic component device Dec 27, 2016
B 6051632 Abrasive and substrate polishing method Dec 27, 2016
B 6051662 Adhesive composition for circuit connection, adhesive sheet, adhesive reel, and circuit member connection structure Dec 27, 2016
B 6051820 Silver sulfide prevention material, method of forming silver sulfide prevention film, and method of manufacturing light emitting device Dec 27, 2016
B 6052304 Expanding method, manufacturing method of semiconductor device, and semiconductor device Dec 27, 2016
B 6052368 Method for producing modified silicone compound, method for producing thermosetting resin composition using the same, method for producing prepreg, and method for producing laminated board and printed wiring board Dec 27, 2016
B 6052369 Heat-resistant aluminum hydroxide particles and method for producing the same, resin composition, prepreg, and laminated plate Dec 27, 2016
B 6052440 Photosensitive resin composition, photosensitive element, resist pattern forming method, and printed wiring board manufacturing method Dec 27, 2016
B 6047328 Coating material for sintered magnet Dec 21, 2016
B 6047888 Adhesive for semiconductor and method for manufacturing semiconductor device Dec 21, 2016
B 6048011 Light control material and light control film Dec 21, 2016
B 6048032 Optical waveguide and manufacturing method thereof Dec 21, 2016
B 6048033 Optical waveguide and manufacturing method thereof Dec 21, 2016
B 6048039 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and its manufacturing method, semiconductor device, and LED device Dec 21, 2016

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6051520 6051557 6051632 6051662 6051820 6052304 6052368 6052369 6052440 6047328 6047888 6048011 6048032 6048033 6048039

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Patent Ranking in Japan

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いわさき特許・商標事務所 埼玉県戸田市

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