Patent Ranking in Japan - Applicant details - Japanese version

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Hitachi Chemical Company, Ltd.

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  2016 Application Ranking      57th  publications: 653 上昇2015: 64th  617)

  2016 Acquisition Ranking      66th  registrations: 432 変わらず2015: 66th  381)

(update:Mar 29, 2023)

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Publication numberTitle of the InventionPublic. dateRemarks
A 2016-201438 Thermoelectric conversion module in airtight case Dec 1, 2016
A 2016-201443 Semiconductor substrate with passivation layer, method of manufacturing the same, solar cell element using the same, method of manufacturing the same, and solar cell Dec 1, 2016
A 2016-201510 Prepreg for printed wiring board, metal-clad laminate using the same, and printed wiring board Dec 1, 2016
A 2016-201573 Method of manufacturing semiconductor device Dec 1, 2016
A 2016-201577 Solar cell unit Dec 1, 2016
A 2016-196530 Abrasive, storage solution for abrasive, and polishing method Nov 24, 2016
A 2016-196569 Alcohol-soluble printing ink binder Nov 24, 2016
A 2016-196646 Circuit connection material and circuit board connection structure Nov 24, 2016
A 2016-197679 Temporary fixing resin composition, temporary fixing resin film, and temporary fixing resin film sheet Nov 24, 2016
A 2016-194013 Adhesive sheet roll and semiconductor device Nov 17, 2016
A 2016-190963 Adhesive film for semiconductor, adhesive film for semiconductor integrated with dicing tape, and semiconductor device Nov 10, 2016
A 2016-190964 Adhesive film Nov 10, 2016
A 2016-190965 Reinforcing FRP with self-binding property Nov 10, 2016
A 2016-190966 Thermosetting resin composition, prepreg, film with resin, laminated board, printed wiring board, and semiconductor package Nov 10, 2016
A 2016-191060 Film adhesive, adhesive sheet, and semiconductor device Nov 10, 2016

76-90 (total:664)

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2016-201438 2016-201443 2016-201510 2016-201573 2016-201577 2016-196530 2016-196569 2016-196646 2016-197679 2016-194013 2016-190963 2016-190964 2016-190965 2016-190966 2016-191060

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