Hitachi Chemical Company, Ltd.
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Publication number | Title of the Invention | Public. date | Remarks |
A 2016-201438
|
Thermoelectric conversion module in airtight case |
Dec 1, 2016 |
|
A 2016-201443
|
Semiconductor substrate with passivation layer, method of manufacturing the same, solar cell element using the same, method of manufacturing the same, and solar cell |
Dec 1, 2016 |
|
A 2016-201510
|
Prepreg for printed wiring board, metal-clad laminate using the same, and printed wiring board |
Dec 1, 2016 |
|
A 2016-201573
|
Method of manufacturing semiconductor device |
Dec 1, 2016 |
|
A 2016-201577
|
Solar cell unit |
Dec 1, 2016 |
|
A 2016-196530
|
Abrasive, storage solution for abrasive, and polishing method |
Nov 24, 2016 |
|
A 2016-196569
|
Alcohol-soluble printing ink binder |
Nov 24, 2016 |
|
A 2016-196646
|
Circuit connection material and circuit board connection structure |
Nov 24, 2016 |
|
A 2016-197679
|
Temporary fixing resin composition, temporary fixing resin film, and temporary fixing resin film sheet |
Nov 24, 2016 |
|
A 2016-194013
|
Adhesive sheet roll and semiconductor device |
Nov 17, 2016 |
|
A 2016-190963
|
Adhesive film for semiconductor, adhesive film for semiconductor integrated with dicing tape, and semiconductor device |
Nov 10, 2016 |
|
A 2016-190964
|
Adhesive film |
Nov 10, 2016 |
|
A 2016-190965
|
Reinforcing FRP with self-binding property |
Nov 10, 2016 |
|
A 2016-190966
|
Thermosetting resin composition, prepreg, film with resin, laminated board, printed wiring board, and semiconductor package |
Nov 10, 2016 |
|
A 2016-191060
|
Film adhesive, adhesive sheet, and semiconductor device |
Nov 10, 2016 |
|
76-90 (total:664)
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2016-201438 2016-201443 2016-201510 2016-201573 2016-201577 2016-196530 2016-196569 2016-196646 2016-197679 2016-194013 2016-190963 2016-190964 2016-190965 2016-190966 2016-191060
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