Hitachi Chemical Company, Ltd.
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Publication number | Title of the Invention | Public. date | Remarks |
B 6222267
|
Method of manufacturing semiconductor device and semiconductor device manufactured using the same |
Nov 1, 2017 |
|
B 6222268
|
Electron-accepting compound and method for producing the same, polymerization initiator containing the compound, organic electronic material, organic thin film using these, organic electronic element, organic electroluminescent element, display element, lighting device, and display device |
Nov 1, 2017 |
|
B 6222395
|
Adhesive sheet with film adhesive and dicing die bonding |
Nov 1, 2017 |
|
B 6217080
|
Solar cell |
Oct 25, 2017 |
|
B 6217199
|
Film-shaped positive photosensitive adhesive composition, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device |
Oct 25, 2017 |
|
B 6217280
|
Thermosetting resin composition and prepreg, laminated board, printed wiring board, and mounting board using the same |
Oct 25, 2017 |
|
B 6217754
|
Fuel cell electrode catalyst, method for producing the same, and membrane electrode assembly using the fuel cell electrode catalyst |
Oct 25, 2017 |
|
B 6217872
|
Dicing tape for integrated dicing/die bonding tape |
Oct 25, 2017 |
|
B 6218348
|
Lithium ion secondary battery and manufacturing method thereof |
Oct 25, 2017 |
|
B 6220492
|
Epoxy resin composition and electronic component device |
Oct 25, 2017 |
|
B 6212970
|
Touch panel electrode protective film and touch panel |
Oct 18, 2017 |
|
B 6213000
|
Mold device for recompression of bearing cap |
Oct 18, 2017 |
|
B 6213055
|
Wafer processing tape |
Oct 18, 2017 |
|
B 6213252
|
Method for producing ground base material, and film-like pressure-sensitive adhesive and laminate used therefor |
Oct 18, 2017 |
|
B 6213618
|
Film adhesive, adhesive sheet, and semiconductor device |
Oct 18, 2017 |
|
61-75 (total:379)
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6222267 6222268 6222395 6217080 6217199 6217280 6217754 6217872 6218348 6220492 6212970 6213000 6213055 6213252 6213618
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