Patent Ranking in Japan - Applicant details - Japanese version

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Hitachi Chemical Company, Ltd.

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　■　2018 Application Ranking      57th 　publications: 675 （下降2017: 42th  952）

　■　2018 Acquisition Ranking      76th 　registrations: 376 （上昇2017: 80th  372）

（update：Nov 25, 2021）

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Publication numberTitle of the InventionPublic. dateRemarks
B 6442968 Method for forming through-holes in laminated body Dec 26, 2018
B 6442973 Photocurable composition for forming fine structure and cured product thereof Dec 26, 2018
B 6443073 Power storage unit Dec 26, 2018
B 6443343 Film for temporary fixing, film sheet for temporary fixing, and semiconductor device Dec 26, 2018
B 6443521 Film adhesive and dicing die bonding integrated adhesive sheet Dec 26, 2018
B 6443657 Thermosetting insulating resin composition, and insulating film with support, prepreg, laminated board and multilayer printed wiring board using the same Dec 26, 2018
B 6444734 Connector and flexible wiring board Dec 26, 2018
B 6439268 Cell trapping device and cell trapping device Dec 19, 2018
B 6439291 Photosensitive resin composition, photosensitive element, semiconductor device, and method for forming resist pattern Dec 19, 2018
B 6439965 Adhesive composition Dec 19, 2018
B 6435602 Cancer cell isolation device Dec 12, 2018
B 6435637 Organic light emitting device Dec 12, 2018
B 6435703 Laminated board and wiring board Dec 12, 2018
B 6435707 Resin composition for mold underfill and electronic component device Dec 12, 2018
B 6435708 Resin composition for mold underfill and electronic component device Dec 12, 2018

1-15 (total:383)

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6442968 6442973 6443073 6443343 6443521 6443657 6444734 6439268 6439291 6439965 6435602 6435637 6435703 6435707 6435708

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Patent Ranking in Japan

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