Patent Ranking in Japan - Applicant details - Japanese version

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DIC Corporation

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  2014 Application Ranking      119th  publications: 394 上昇2013: 130th  384)

  2014 Acquisition Ranking      88th  registrations: 437 上昇2013: 121th  343)

(update:Apr 22, 2021)

2011  2012  2013  2015  2016  2017  2018  2019  2020  2021 

公報番号発明の名称公報発行日備考
特許 5640883 Liquid crystal composition containing polymerizable compound and liquid crystal display device using the same Dec 17, 2014
特許 5641306 Method for manufacturing decorative molded body Dec 17, 2014
特許 5641307 Method for producing vacuum molded article having uneven pattern and resin container Dec 17, 2014
特許 5640588 Method for producing phosphorus atom-containing epoxy resin, curable resin composition, cured product thereof, resin composition for printed wiring board, printed wiring board, resin composition for flexible wiring board, resin composition for semiconductor encapsulating material, and build Resin composition for interlayer insulating material for up-board Dec 17, 2014
特許 5641382 UV-curable adhesive composition and adhesive Dec 17, 2014
特許 5641286 Transparent insulating composition Dec 17, 2014
特許 5641313 Laminated sheet for back surface decoration, back surface decoration body and method for manufacturing back surface decoration body Dec 17, 2014
特許 5641312 Non-combustible veneer Dec 17, 2014
特許 5637413 Water-based ink set for inkjet recording Dec 10, 2014
特許 5637421 Liquid crystal display Dec 10, 2014
特許 5636661 Black ink composition Dec 10, 2014
特許 5637418 Phosphorus atom-containing active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film Dec 10, 2014
特許 5639954 A developer ink composition for an inkjet, and a pressure-sensitive recorder using the ink composition. Dec 10, 2014 共同出願
特許 5637419 Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed wiring board Dec 10, 2014
特許 5637368 Curable resin composition, cured product thereof, method for producing phosphorus atom-containing phenol compound, resin composition for printed wiring board, printed wiring board, resin composition for flexible wiring board, resin composition for semiconductor encapsulating material, and build Resin composition for interlayer insulating material for up-board Dec 10, 2014

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5640883 5641306 5641307 5640588 5641382 5641286 5641313 5641312 5637413 5637421 5636661 5637418 5639954 5637419 5637368

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