Patent Ranking in Japan - Applicant details - Japanese version

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DIC Corporation

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　■　2016 Application Ranking      113th 　publications: 382 （下降2015: 111th  412）

　■　2016 Acquisition Ranking      75th 　registrations: 391 （上昇2015: 88th  313）

（update：Jan 11, 2022）

2011  2012  2013  2014  2015  2017  2018  2019  2020  2021  2022 

Publication numberTitle of the InventionPublic. dateRemarks
B 6051566 Polymerizable compound having saturated ring structure Dec 27, 2016
B 6051981 Process for producing active energy curable yellow pigment dispersion and active energy ray curable yellow ink for inkjet recording Dec 27, 2016
B 6052058 Water-based ink set for inkjet recording Dec 27, 2016
B 6052432 Temperature-responsive cell culture substrate and method for producing the same Dec 27, 2016
B 6047261 Compound, organic semiconductor material containing the same, organic semiconductor ink and organic transistor Dec 21, 2016
B 6047884 Compound Dec 21, 2016
B 6048035 Cresol-naphthol resin, curable resin composition, cured product thereof, and printed wiring board Dec 21, 2016
B 6048619 Curing agent for epoxy resin and epoxy resin composition using the same Dec 21, 2016
B 6048734 Active ester resin, curable resin composition, cured product thereof, and printed wiring board Dec 21, 2016
B 6048738 Active ester resin, curable resin composition, cured product thereof, and printed wiring board Dec 21, 2016
B 6048781 Printing agent, fabric, and method for producing printing agent Dec 21, 2016
B 6048782 Liquid crystal compound having ethane bond Dec 21, 2016
B 6042054 Thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film Dec 14, 2016
B 6044199 Method for producing polymer Dec 14, 2016
B 6044820 Adhesive composition and wet friction plate Dec 14, 2016

1-15 (total:402)

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6051566 6051981 6052058 6052432 6047261 6047884 6048035 6048619 6048734 6048738 6048781 6048782 6042054 6044199 6044820

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Patent Ranking in Japan

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