Patent Ranking in Japan - Applicant details - Japanese version

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DIC Corporation

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  2016 Application Ranking      113th  publications: 382 下降2015: 111th  412)

  2016 Acquisition Ranking      75th  registrations: 391 上昇2015: 88th  313)

(update:Jan 11, 2022)

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Publication numberTitle of the InventionPublic. dateRemarks
B 6044821 Flame-retardant polyamide resin composition and molded article thereof Dec 14, 2016
B 6044822 Thermally conductive adhesive tape Dec 14, 2016
B 6044825 Nematic liquid crystal composition Dec 14, 2016
B 6044826 Nematic liquid crystal composition Dec 14, 2016
B 6044829 Cyanate ester resin, curable resin composition, cured product thereof, prepreg, circuit board, semiconductor sealing material, and build-up film. Dec 14, 2016
B 6037192 Heat storage molded body, heat storage laminated body, and method for manufacturing heat storage molded body Dec 7, 2016
B 6040652 Compounds and color filters Dec 7, 2016
B 6040725 Phenoxy resin, curable resin composition, cured product thereof, prepreg, circuit board, and build-up film Dec 7, 2016
B 6040901 Adhesive composition for laminated laminate, laminate using the same, and secondary battery Dec 7, 2016
B 6041071 Urethane composition and abrasive Dec 7, 2016
B 6041078 Heat storage molded body, heat storage laminated body, and method for manufacturing heat storage molded body Dec 7, 2016
B 6041123 Easy-to-penetrate lid material for glass containers Dec 7, 2016
B 6041178 Adhesive tape, article, motor and method for producing article Dec 7, 2016
B 6041179 Green pigment composition for color filter and color filter Dec 7, 2016
B 6032382 Active energy ray curable resin composition, method for producing the same, paint, coating film, and laminated film Nov 30, 2016

16-30 (total:402)

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6044821 6044822 6044825 6044826 6044829 6037192 6040652 6040725 6040901 6041071 6041078 6041123 6041178 6041179 6032382

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Patent Ranking in Japan

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1月26日(水) - 東京 新宿区

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1月27日(木) - 神奈川 川崎市

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