Patent Ranking in Japan - Applicant details - Japanese version

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DIC Corporation

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  2020 Application Ranking      82th  publications: 338 上昇2019: 115th  399)

  2020 Acquisition Ranking      96th  registrations: 217 下降2019: 77th  337)

(update:Sep 30, 2020)

2011  2012  2013  2014  2015  2016  2017  2018  2019 

Publication numberTitle of the InventionPublic. dateRemarks
2019-123941 Epoxy compounds, compositions, cured products and laminates Sep 24, 2020
2019-123943 Hydroxy compounds, compositions, cured products and laminates Sep 24, 2020
2019-208374 Polyarylene sulfide resin composition, molded product, composite molded product and method for producing them Sep 24, 2020
2020-3879 Method for manufacturing a molded product having a metal pattern Sep 24, 2020
2020-12969 Primers for inkjet printing inks, recording media and printing systems Sep 24, 2020
A 2020-152924 Adhesive tape Sep 24, 2020
A 2020-153109 Active energy ray-curable concrete protective material Sep 24, 2020
2019-123942 Resin composition, cured product and laminate Sep 17, 2020
2020-3878 Manufacturing method of printed wiring board Sep 17, 2020
2020-32171 Purification method and production method of polyarylene sulfide Sep 17, 2020
A 2020-147576 Polymerizable compounds and liquid crystal compositions and liquid crystal display devices using them Sep 17, 2020
A 2020-147577 Compounds, compositions and display devices Sep 17, 2020
A 2020-147623 Manufacturing method of cured product, three-dimensional modeled product and cured product Sep 17, 2020
A 2020-147687 Urethane resin composition, adhesive, and floor structure Sep 17, 2020
A 2020-147756 Epoxy compounds, compositions, cured products and laminates Sep 17, 2020

1-15 (total:344)

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2019-123941 2019-123943 2019-208374 2020-3879 2020-12969 2020-152924 2020-153109 2019-123942 2020-3878 2020-32171 2020-147576 2020-147577 2020-147623 2020-147687 2020-147756

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Patent Ranking in Japan

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