Patent Ranking in Japan - Applicant details - Japanese version

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Sekisui Chemical Co., Ltd.

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　■　2021 Application Ranking      34th 　publications: 141 （上昇2020: 35th  873）

　■　2021 Acquisition Ranking      41th 　registrations: 89 （上昇2020: 47th  494）

（update：Feb 25, 2021）

2011  2012  2013  2014  2015  2016  2017  2018  2019  2020 

Publication numberTitle of the InventionPublic. dateRemarks
B 6832055 Thermally expandable bushing Feb 24, 2021
B 6832056 Makeup body difference, attachment structure of makeup body difference, and how to repair the building Feb 24, 2021
B 6832062 A method for manufacturing a resin film for bonding glass plates, a laminate containing glass plates, and a resin film for bonding glass plates. Feb 24, 2021
B 6832072 Steps, stairs and buildings Feb 24, 2021
B 6832074 Drainage structure of the building and the building Feb 24, 2021
B 6832081 Multi-layer foam and method for manufacturing multi-layer foam Feb 24, 2021
B 6832109 Spiral tube manufacturing method and pipe making equipment Feb 24, 2021
B 6832112 Crosslinked polyolefin resin foam Feb 24, 2021
B 6832119 Pipe joint structure and pipe joining method Feb 24, 2021
B 6832140 Reinforcement structure and reinforcement method Feb 24, 2021
B 6832142 Phenol resin foam plate and its manufacturing method Feb 24, 2021
B 6832143 Method for producing phenol resin foam and phenol resin foam Feb 24, 2021
B 6832161 Conductive adhesive tape Feb 24, 2021
B 6832185 Step plate support material and staircase structure Feb 24, 2021
B 6832211 Ground survey equipment and ground survey method Feb 24, 2021

1-15 (total:89)

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6832055 6832056 6832062 6832072 6832074 6832081 6832109 6832112 6832119 6832140 6832142 6832143 6832161 6832185 6832211

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Patent Ranking in Japan

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