Patent Ranking in Japan - Applicant details - Japanese version

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Lintec Co., Ltd.

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  2014 Application Ranking      169th  publications: 273 上昇2013: 174th  288)

  2014 Acquisition Ranking      119th  registrations: 361 上昇2013: 147th  278)

(update:Jun 28, 2022)

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公報番号発明の名称公報発行日備考
特許 5603100 Sheet cutting device and cutting method Oct 8, 2014
特許 5602669 Methods for Manufacturing Adhesive Compositions for Semiconductors, Adhesive Sheets for Semiconductors, and Semiconductor Devices Oct 8, 2014
特許 5602374 Adhesive composition and adhesive sheet Oct 8, 2014
特許 5602670 Adhesives and adhesive sheets Oct 8, 2014
特許 5603101 Sheet cutting device and cutting method Oct 8, 2014
特許 5603757 Manufacturing method of adhesive sheet for laser dicing and semiconductor device Oct 8, 2014
特許 5597356 Sheet manufacturing equipment and manufacturing method Oct 1, 2014
特許 5597562 Release sheet replacement device and replacement method, and sheet manufacturing device and manufacturing method Oct 1, 2014
特許 5597578 Sheet manufacturing equipment and manufacturing method Oct 1, 2014
特許 5597365 Printing equipment and printing method Oct 1, 2014
特許 5599177 Optical Adhesive Composition, Optical Adhesive and Optical Film Oct 1, 2014
特許 5597568 IC tag Oct 1, 2014
特許 5599216 Exfoliating sheet Oct 1, 2014
特許 5596129 Base film for dicing sheet and dicing sheet Sep 24, 2014
特許 5595321 Adhesive compositions, adhesives and adhesive sheets Sep 24, 2014

61-75 (total:361)

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5603100 5602669 5602374 5602670 5603101 5603757 5597356 5597562 5597578 5597365 5599177 5597568 5599216 5596129 5595321

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Patent Ranking in Japan

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