Patent Ranking in Japan - Applicant details - Japanese version

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JX Nippon Mining & Metals Co., Ltd.

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  2013 Application Ranking      158th  publications: 313 上昇2012: 176th  256)

  2013 Acquisition Ranking      176th  registrations: 235 上昇2012: 224th  173)

(update:Dec 9, 2022)

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公報番号発明の名称公報発行日備考
特許 5362921 Surface-treated copper foil and laminated board using it Dec 11, 2013
特許 5362924 Surface-treated copper foil and laminate using the same Dec 11, 2013
特許 5362922 Surface-treated copper foil and laminate using the same Dec 11, 2013
特許 5367613 Copper foil for printed wiring boards Dec 11, 2013
特許 5367660 Oxide sintered body and oxide semiconductor thin film Dec 11, 2013
特許 5362898 Surface-treated copper foil and laminated boards using it, printed wiring boards, and copper-clad laminated boards Dec 11, 2013
特許 5364838 Copper foil with carrier Dec 11, 2013
特許 5364202 Sb-Te group alloy sintered body sputtering target Dec 11, 2013
特許 5364173 Sputtering target Dec 11, 2013
特許 5362785 Lead button processing device and lead button processing method Dec 11, 2013
特許 5367659 Oxide sintered body and oxide semiconductor thin film Dec 11, 2013
特許 5362923 Surface-treated copper foil and laminated board using it Dec 11, 2013
特許 5362899 Surface-treated copper foil and laminate using the same Dec 11, 2013
特許 5358586 Rolled copper foil or electrolytic copper foil for electronic circuits and methods for forming electronic circuits using these Dec 4, 2013
特許 5358740 Manufacturing method of copper foil with carrier, copper-clad laminate using it, printed wiring board, printed circuit board, and printed wiring board Dec 4, 2013

16-30 (total:235)

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5362921 5362924 5362922 5367613 5367660 5362898 5364838 5364202 5364173 5362785 5367659 5362923 5362899 5358586 5358740

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Patent Ranking in Japan

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