Patent Ranking in Japan - Applicant details - Japanese version

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Hitachi Chemical Company, Ltd.

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  2013 Application Ranking      82th  publications: 562 上昇2012:   0)

  2013 Acquisition Ranking      95th  registrations: 431 上昇2012:   0)

(update:Jan 11, 2022)

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公報番号発明の名称公報発行日備考
特許 5359349 Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element and its manufacturing method, and optical semiconductor device Dec 4, 2013
特許 5360124 Die bonding resin paste and its application Dec 4, 2013
特許 5359495 Water-based heat-resistant resin composition, paint using this water-based heat-resistant resin composition, home appliances and kitchen utensils using this paint Dec 4, 2013
特許 5360055 Optical waveguide manufacturing method and optical waveguide Dec 4, 2013
特許 5359276 Light control film and light control glass Dec 4, 2013
特許 5360508 Resin composition, prepreg using the same, and printed wiring board Dec 4, 2013
特許 5360477 Photosensitive element, method of forming resist pattern, and method of manufacturing printed wiring board Dec 4, 2013
特許 5354291 A method for manufacturing a spacer for a liquid crystal display device, an ink for forming a spacer, and a liquid crystal display device and a method for manufacturing the same. Nov 27, 2013
特許 5354283 Electrode base material for solar cells Nov 27, 2013
特許 5353449 Semiconductor device manufacturing method, semiconductor sealing adhesive, and semiconductor device Nov 27, 2013
特許 5353064 Photosensitive adhesive composition, adhesive film, adhesive sheet, adhesive pattern obtained using the same, and semiconductor device Nov 27, 2013
特許 5353238 Oxide particle manufacturing method, slurry, polishing agent, and substrate polishing method Nov 27, 2013
特許 5354113 Adhesive, adhesive using the same, and method of using them Nov 27, 2013
特許 5353702 Manufacturing method of semiconductor chip with adhesive film, adhesive film for semiconductor used in this manufacturing method, and manufacturing method of semiconductor device Nov 27, 2013
特許 5353614 Board insertion connector and manufacturing method thereof Nov 27, 2013

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5359349 5360124 5359495 5360055 5359276 5360508 5360477 5354291 5354283 5353449 5353064 5353238 5354113 5353702 5353614

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Patent Ranking in Japan

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1月26日(水) - 東京 新宿区

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1月27日(木) - 神奈川 川崎市

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特許事務所紹介 IP Force 特許事務所紹介

海嶺知財経営コンサルタント事務所

〒973-8403 福島県いわき市内郷綴町榎下16-3 内郷商工会別棟事務所2階 特許・実用新案 意匠 商標 コンサルティング 

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名古屋本部オフィス 〒450-0002 愛知県名古屋市中村区名駅3-13-24 第一はせ川ビル6F http://aigipat.com/ 岐阜オフィス 〒509-0124 岐阜県各務原市鵜沼山崎町3丁目146番地1 PACビル2階(旧横山ビル) http://gifu.aigipat.com/ 特許・実用新案 意匠 商標 外国特許 外国意匠 外国商標 訴訟 鑑定 コンサルティング 

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